Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9831170 | Fully molded miniaturized semiconductor module | Timothy L. Olson | 2017-11-28 | |
| 9768124 | Semiconductor package in package | Christopher J. Berry | 2017-09-19 | $19,763,000 |
| 9761571 | Thermally enhanced fully molded fan-out module | — | 2017-09-12 | |
| 9754835 | Semiconductor device and method comprising redistribution layers | Craig Bishop | 2017-09-05 | |
| 9613912 | Method of marking a semiconductor package | — | 2017-04-04 | |
| 9613830 | Fully molded peripheral package on package device | William Boyd Rogers, Craig Bishop | 2017-04-04 | |
| 9576919 | Semiconductor device and method comprising redistribution layers | Craig Bishop | 2017-02-21 |