Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754894 | Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing | Takeshi Matsumura, Goji Shiga, Kosuke Morita | 2017-09-05 |
| 9659883 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package | Kosuke Morita, Tsuyoshi Ishizaka, Eiji Toyoda, Goji Shiga, Jun Ishii | 2017-05-23 |