Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659883 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package | Kosuke Morita, Tsuyoshi Ishizaka, Goji Shiga, Chie Iino, Jun Ishii | 2017-05-23 |