Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842811 | Heat-dissipating semiconductor package for lessening package warpage | — | 2017-12-12 |
| 9831219 | Manufacturing method of package structure | Yong-Cheng Chuang, Kuo-Ting Lin, Li-Chih Fang | 2017-11-28 |