Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837595 | Semiconductor package assembly with thermal recycling function | Long Yu, Chia-Wei Chi, Chia-Feng Yeh, Tai-Yu Chen | 2017-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837595 | Semiconductor package assembly with thermal recycling function | Long Yu, Chia-Wei Chi, Chia-Feng Yeh, Tai-Yu Chen | 2017-12-05 |