Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837595 | Semiconductor package assembly with thermal recycling function | Long Yu, Chin-Chiang Chang, Chia-Wei Chi, Tai-Yu Chen | 2017-12-05 |
| 9785157 | Method for controlling circuit modules within chip and associated system on chip | Wei Wang | 2017-10-10 |
| 9535553 | Transmitting devices and transmission methods | Yanni HUANG, Lin Xu | 2017-01-03 |