Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768124 | Semiconductor package in package | Christopher M. Scanlan | 2017-09-19 |
| 9711485 | Thin bonded interposer package | Roger D. St.Amand, Jin Seong Kim | 2017-07-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768124 | Semiconductor package in package | Christopher M. Scanlan | 2017-09-19 |
| 9711485 | Thin bonded interposer package | Roger D. St.Amand, Jin Seong Kim | 2017-07-18 |