Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842797 | Stacked die power converter | Brian Ashley Carpenter, Christopher J. Sanzo, William Todd Harrison, Matthew David Romig | 2017-12-12 |
| 9768098 | Packaged semiconductor device having stacked attached chips overhanging the assembly pad | Reynaldo Corpuz Javier, Andy Quang Tran | 2017-09-19 |
| 9721859 | Semi-hermetic semiconductor package | Andy Quang Tran, Reynaldo Corpuz Javier | 2017-08-01 |
| 9576886 | Flat no-lead packages with electroplated edges | Reynaldo Corpuz Javier, Andy Quang Tran | 2017-02-21 |