Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768098 | Packaged semiconductor device having stacked attached chips overhanging the assembly pad | Alok Kumar Lohia, Andy Quang Tran | 2017-09-19 |
| 9721859 | Semi-hermetic semiconductor package | Andy Quang Tran, Alok Kumar Lohia | 2017-08-01 |
| 9576886 | Flat no-lead packages with electroplated edges | Alok Kumar Lohia, Andy Quang Tran | 2017-02-21 |