Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9841920 | Heterogeneous memory die stacking for energy efficient computing | — | 2017-12-12 |
| 9818457 | Extended platform with additional memory module slots per CPU socket | Bruce Querbach | 2017-11-14 |
| 9768148 | Stacked memory with interface providing offset interconnects | Andre Schaefer, Warren R. Morrow, John B. Halbert, Jin-Sung Kim, Kenneth D. Shoemaker | 2017-09-19 |
| 9652170 | Memory device responding to device commands for operational controls | — | 2017-05-16 |
| 9627357 | Stacked memory allowing variance in device interconnects | Kenneth D. Shoemaker | 2017-04-18 |