Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741651 | Redistribution layer lines | Sven Albers, Christian Geissler | 2017-08-22 |
| 9711492 | Three dimensional structures within mold compound | Sven Albers, Andreas Wolter, Thorsten Meyer | 2017-07-18 |
| 9646856 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Thorsten Meyer, David O'Sullivan | 2017-05-09 |