Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646856 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Thorsten Meyer, Klaus Reingruber | 2017-05-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646856 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Thorsten Meyer, Klaus Reingruber | 2017-05-09 |