Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9646856 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Thorsten Meyer, Klaus Reingruber | 2017-05-09 | $10,144,000 |