Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9802274 | Hybrid lead-free solder wire | Hongwen Zhang | 2017-10-31 |
| 9741676 | Tin-indium based low temperature solder alloy | Jianguo Luo | 2017-08-22 |
| 9636784 | Mixed alloy solder paste | Hongwen Zhang | 2017-05-02 |