HZ

Hongwen Zhang

IN Indium: 2 patents #2 of 3Top 70%
📍 Utica, NY: #2 of 5 inventorsTop 40%
🗺 New York: #2,508 of 12,278 inventorsTop 25%
Overall (2017): #146,868 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9802274 Hybrid lead-free solder wire Ning-Cheng Lee 2017-10-31
9636784 Mixed alloy solder paste Ning-Cheng Lee 2017-05-02