Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9702906 | Non-permanent termination structure for microprobe measurements | Michael A. Cracraft, Jayapreetha Natesan, John G. Torok | 2017-07-11 | $1,748,000 |
| 9646925 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-05-09 | $2,584,000 |
| 9627787 | DIMM connector region vias and routing | Wiren D. Becker, William L. Brodsky, Michael A. Cracraft | 2017-04-18 | $1,813,000 |
| 9600619 | Distribution of power vias in a multi-layer circuit board | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-03-21 | $2,195,000 |
| 9594865 | Distribution of power vias in a multi-layer circuit board | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-03-14 | $3,628,000 |
| 9548551 | DIMM connector region vias and routing | Wiren D. Becker, William L. Brodsky, Michael A. Cracraft | 2017-01-17 | $4,498,000 |
| 9543241 | Interconnect array pattern with a 3:1 signal-to-ground ratio | Zhaoqing Chen, Rohan U. Mandrekar, Tingdong Zhou | 2017-01-10 | $4,562,000 |