Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773725 | Coreless multi-layer circuit substrate with minimized pad capacitance | Mahesh Bohra, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar | 2017-09-26 |
| 9548769 | Reduced wiring requirements with signal slope manipulation | Mahesh Bohra, Jinwoo Choi, Lloyd A. Walls | 2017-01-17 |