Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9772268 | Predicting semiconductor package warpage | Stephen P. Ayotte, Travis S. Longenbach | 2017-09-26 |
| 9613900 | Nanoscale interconnect structure | Chih-Chao Yang, Stephan A. Cohen | 2017-04-04 |
EL
Eric G. Liniger
Overall (2017): #155,121 of 506,227Top 35%
2
Patents 2017