Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748169 | Treating copper interconnects | Chih-Chao Yang | 2017-08-29 |
| 9748173 | Hybrid interconnects and method of forming the same | Chih-Chao Yang | 2017-08-29 |
| 9735051 | Semiconductor device interconnect structures formed by metal reflow process | Chih-Chao Yang | 2017-08-15 |