YI

Yasushi Inagaki

IC Ibiden Co.: 9 patents #1 of 85Top 2%
AC Alps Electric Co.: 1 patents #26 of 133Top 20%
Overall (2017): #6,514 of 506,227Top 2%
10
Patents 2017

Issued Patents 2017

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
9854669 Package substrate Toshiki Furutani 2017-12-26
9793241 Printed wiring board 2017-10-17
9763319 Package substrate and method for manufacturing package substrate Yasuhiro Takahashi, Satoshi Kurokawa 2017-09-12
9716059 Package substrate and method for manufacturing package substrate Osamu Futonagane 2017-07-25
9704795 Printed wiring board and method for manufacturing the same Kota Noda 2017-07-11
9699909 Wiring board with built-in electronic component Naohito Ishiguro 2017-07-04
9655242 Printed wiring board Toshiki Furutani 2017-05-16
9638885 Lens driving apparatus Katsuhiko OTOMO 2017-05-02
9564392 Printed wiring board and semiconductor package Toshiki Furutani, Shunsuke Sakai 2017-02-07
9538651 Printed wiring board and method for manufacturing the same Kota Noda 2017-01-03