Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9854669 | Package substrate | Yasushi Inagaki | 2017-12-26 |
| 9807885 | Wiring board with built-in electronic component and method for manufacturing the same | Kenji Sakai, Tomoyuki Ikeda | 2017-10-31 |
| 9655242 | Printed wiring board | Yasushi Inagaki | 2017-05-16 |
| 9655249 | Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor | Toyotaka Shimabe, Masahiro Kaneko, Takeshi Tashima, Yasuyuki Shimada, Naoki Shimizu | 2017-05-16 |
| 9601422 | Printed wiring board, semiconductor package, and method for manufacturing printed wiring board | Yuki Yoshikawa | 2017-03-21 |
| 9564392 | Printed wiring board and semiconductor package | Shunsuke Sakai, Yasushi Inagaki | 2017-02-07 |
| 9536801 | Electronic component having encapsulated wiring board and method for manufacturing the same | Daiki Komatsu, Nobuya Takahashi | 2017-01-03 |