Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831104 | Techniques for molded underfill for integrated circuit dies | Suresh Ramalingam | 2017-11-28 |
| 9627329 | Interposer with edge reinforcement and method for manufacturing same | Suresh Ramalingam | 2017-04-18 |