Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831104 | Techniques for molded underfill for integrated circuit dies | Woon-Seong Kwon | 2017-11-28 |
| 9812374 | Thermal management device with textured surface for extended cooling limit | Gamal Refai-Ahmed, Brian D. Philofsky | 2017-11-07 |
| 9627329 | Interposer with edge reinforcement and method for manufacturing same | Woon-Seong Kwon | 2017-04-18 |