Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548255 | IC package having non-horizontal die pad and flexible substrate therefor | Meng Kong Lye, Zhijie Wang | 2017-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548255 | IC package having non-horizontal die pad and flexible substrate therefor | Meng Kong Lye, Zhijie Wang | 2017-01-17 |