Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633959 | Integrated circuit die with corner IO pads | Shailesh Kumar, Vikas Garg | 2017-04-25 |
| 9548255 | IC package having non-horizontal die pad and flexible substrate therefor | You Ge, Zhijie Wang | 2017-01-17 |