Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9798692 | Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module | Chao-Chun Lu, Jan-Mye Sung | 2017-10-24 |
| 9748002 | System-in-package module with memory | Chao-Chun Lu | 2017-08-29 |
| 9601456 | System-in-package module and manufacture method for a system-in-package module | Bor-Doou Rong | 2017-03-21 |