Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601456 | System-in-package module and manufacture method for a system-in-package module | Weng-Dah Ken | 2017-03-21 |
| 9589931 | Bundled memory and manufacture method for a bundled memory with an external input/output bus | Chun Shiah | 2017-03-07 |