Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741875 | Sensor chip package structure and manufacturing method thereof | Chi-Chih Shen, Yen-Hsin Chen | 2017-08-22 |
| 9536914 | Front side illuminated semiconductor structure with improved light absorption efficiency | Sen-Huang Huang, Huan-Kun Pan, Ching-Wei Chen | 2017-01-03 |