Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741875 | Sensor chip package structure and manufacturing method thereof | Chi-Chih Shen, Yi-Chang Chang | 2017-08-22 |
YC
Yen-Hsin Chen
Overall (2017): #190,421 of 506,227Top 40%
1
Patents 2017