Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748119 | Wafer processing method | Senichi Ryo, Toshiyuki Yoshikawa, Yukinobu Ohura | 2017-08-29 |
| 9620355 | Wafer processing method | Senichi Ryo, Toshiyuki Yoshikawa, Yukinobu Ohura | 2017-04-11 |
| 9543191 | Wiring structure having interlayer insulating film and wiring line without a barrier layer between | Takenao Nemoto, Takehisa Saito, Yugo Tomita, Akihide Shirotori, Akinobu Teramoto +1 more | 2017-01-10 |