Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741590 | Stack frame for electrical connections and the method to fabricate thereof | Bau-Ru Lu, Yi-Cheng Lin | 2017-08-22 |
| 9734944 | Electronic package structure comprising a magnetic body and an inductive element and method for making the same | Bau-Ru Lu, Kai-Peng Chiang, Tsung-Chan Wu | 2017-08-15 |
| 9735091 | Package structure and manufacturing method thereof | Han-Hsiang Lee, Yi-Cheng Lin | 2017-08-15 |
| 9673156 | Package structure | Yiu-Wai Lai | 2017-06-06 |
| 9601412 | Three-dimensional package structure | Chun-Tiao Liu, Chau-Chun Wen | 2017-03-21 |
| 9538660 | Electronic package structure | Chun-Tiao Liu, Bau-Ru Lu | 2017-01-03 |