Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799722 | Inductive component and package structure thereof | — | 2017-10-24 |
| 9741590 | Stack frame for electrical connections and the method to fabricate thereof | Da-Jung Chen, Yi-Cheng Lin | 2017-08-22 |
| 9734944 | Electronic package structure comprising a magnetic body and an inductive element and method for making the same | Kai-Peng Chiang, Da-Jung Chen, Tsung-Chan Wu | 2017-08-15 |
| 9668359 | Circuit module having surface-mount pads on a lateral surface for connecting with a circuit board | — | 2017-05-30 |
| 9655253 | Method of fabrication of encapsulated electronics devices mounted on a redistribution layer | Ming-Chia Wu | 2017-05-16 |
| 9536798 | Package structure and the method to fabricate thereof | Jeng-Jen Li, Kun-Hong Shih, Kaipeng Chiang | 2017-01-03 |
| 9538660 | Electronic package structure | Da-Jung Chen, Chun-Tiao Liu | 2017-01-03 |