Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D790486 | LED package with truncated encapsulant | Jesse Colin Reiherzer, Jeremy Nevins, Michael John Bergmann | 2017-06-27 |
| 9653643 | Wafer level packaging of light emitting diodes (LEDs) | Michael John Bergmann, David T. Emerson, Christopher P. Hussell | 2017-05-16 |
| D783547 | LED package | Michael John Bergmann, Jesse Colin Reiherzer, Benjamin A. Jacobson, Sung Chul Joo | 2017-04-11 |
| D777122 | LED package | Michael John Bergmann, Jesse Colin Reiherzer, Benjamin A. Jacobson, Sung Chul Joo | 2017-01-24 |