Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818919 | LED package with multiple element light source and encapsulant having planar surfaces | Theodore Lowes, Eric Tarsa, Sten Heikman, Bernd Keller, Hormoz Benjamin | 2017-11-14 |
| 9780268 | Submount based surface mount device (SMD) light emitter components and methods | Christopher P. Hussell, Erin R. F. Welch, Peter Scott Andrews | 2017-10-03 |
| 9691949 | Submount based light emitter components and methods | Sung Chul Joo | 2017-06-27 |
| D790486 | LED package with truncated encapsulant | Jeremy Nevins, Joseph G. Clark, Michael John Bergmann | 2017-06-27 |
| D783547 | LED package | Michael John Bergmann, Joseph G. Clark, Benjamin A. Jacobson, Sung Chul Joo | 2017-04-11 |
| 9601673 | Light emitting diode (LED) components including LED dies that are directly attached to lead frames | Michael John Bergmann, Colin Blakely, Arthur Fong-Yuen Pun | 2017-03-21 |
| 9590155 | Light emitting devices and substrates with improved plating | Christopher P. Hussell, Erin R. F. Welch | 2017-03-07 |
| D778848 | Solid state light emitter component | Colin Blakely | 2017-02-14 |
| D777122 | LED package | Michael John Bergmann, Joseph G. Clark, Benjamin A. Jacobson, Sung Chul Joo | 2017-01-24 |