Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735038 | Process for manufacturing a semiconductor structure with temporary bonding via metal layers | Paul GONDCHARTON, Lamine Benaissa, Anne-Marie Charvet | 2017-08-15 |
BI
Bruno Imbert
Overall (2017): #474,754 of 506,227Top 95%
1
Patents 2017