Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735038 | Process for manufacturing a semiconductor structure with temporary bonding via metal layers | Paul GONDCHARTON, Lamine Benaissa, Bruno Imbert | 2017-08-15 |
AC
Anne-Marie Charvet
Overall (2017): #492,896 of 506,227Top 100%
1
Patents 2017