Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711799 | Copper foil having uniform thickness and methods for manufacturing the copper foil | Kuei-Sen Cheng, Jui-Chang Chou | 2017-07-18 |
| 9673646 | Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board | Kuei-Sen Cheng | 2017-06-06 |
| 9647272 | Surface-treated copper foil | Kuei-Sen Cheng, Hsi-Hsing Lo, Huei-Fang Huang | 2017-05-09 |
| 9562298 | Electrodeposited copper foil | Jui-Chang Chou, Kuei-Sen Cheng, Hsi-Hsing Lo, Yueh-Min Liu | 2017-02-07 |