Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711799 | Copper foil having uniform thickness and methods for manufacturing the copper foil | Yao-Sheng Lai, Kuei-Sen Cheng | 2017-07-18 |
| 9562298 | Electrodeposited copper foil | Kuei-Sen Cheng, Yao-Sheng Lai, Hsi-Hsing Lo, Yueh-Min Liu | 2017-02-07 |