FS

Florian Speer

BA Besi Switzerland Ag: 1 patents #1 of 5Top 20%
📍 Hermann, MO: #1 of 4 inventorsTop 25%
🗺 Missouri: #629 of 2,250 inventorsTop 30%
Overall (2017): #424,271 of 506,227Top 85%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9721819 Method for mounting semiconductors provided with bumps on substrate locations of a substrate 2017-08-01