Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9787914 | Stacked modular architecture high-resolution thermal chip camera | Louise Sengupta, Pierre-Alain S. Auroux, Evan A Binkerd, Richard Blackwell, Mihir D. Boal +2 more | 2017-10-10 |