Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9787914 | Stacked modular architecture high-resolution thermal chip camera | Louise Sengupta, Pierre-Alain S. Auroux, Evan A Binkerd, Richard Blackwell, Jeffrey F. Bryant +2 more | 2017-10-10 |
| 9640068 | Device for establishing communications interoperability at an incident site including means for recording crisis incidents | Michael F. Greene, William E. Tonseth, William J. Delaney | 2017-05-02 |