Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9791014 | Enhanced damping materials using negative stiffness inserts | Geoffrey P. McKnight, Andrew C. Keefe, William Carter | 2017-10-17 |
| 9762334 | Photonic integrated circuit using chip integration | Guilhem de Valicourt | 2017-09-12 |
| 9719863 | Thermomagnetic temperature sensing | John Wang, Geoffrey P. McKnight, Ping Liu | 2017-08-01 |
| 9666495 | Method for reducing core-to-core mismatches in SOC applications | Sheng-Tang Wang, Shih-Che Lin, Chao-Jui Wang | 2017-05-30 |
| 9647122 | Semiconductor device and method of forming the same | Chi-Wen Liu, Hsin-Chieh Huang, Cheng-Chien Li | 2017-05-09 |
| 9634122 | Device boost by quasi-FinFET | Ru-Shang Hsiao, Ling-Sung Wang, Chih-Mu Huang | 2017-04-25 |
| 9618396 | Thermomagnetic resonator-based temperature sensing | Hyok Jae Song | 2017-04-11 |
| 9564487 | Dual vertical channel | Ru-Shang Hsiao, Huang Jiun-Jie, Ling-Sung Wang | 2017-02-07 |