Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9758372 | MEMS package with MEMS die, magnet, and window substrate fabrication method and structure | Bob Shih-Wei Kuo, Shaun Bowers | 2017-09-12 |
| 9670445 | Microfluidics sensor package fabrication method and structure | Bob Shih-Wei Kuo | 2017-06-06 |