Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9776855 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2017-10-03 |
| 9758372 | MEMS package with MEMS die, magnet, and window substrate fabrication method and structure | Shaun Bowers, Russell Shumway | 2017-09-12 |
| 9670445 | Microfluidics sensor package fabrication method and structure | Russell Shumway | 2017-06-06 |