Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9848111 | Imager module with molded packaging | Tak Shing Pang | 2017-12-19 | $123,160,000 |
| 9838599 | Multiple camera alignment system with rigid substrates | Tak Shing Pang, Wei Li | 2017-12-05 | $70,058,000 |
| 9838600 | Multiple camera alignment system with flexible substrates and stiffener members | Tak Shing Pang, Wei Li | 2017-12-05 | $70,058,000 |
| 9793316 | Imager module with interposer chip | — | 2017-10-17 | $37,690,000 |
| 9748460 | LED back end assembly and method of manufacturing | Murad Kurwa, Shing Dick Pang Tak | 2017-08-29 | |
| 9706092 | Imager module with castellated interposer chip | Tak Shing Pang | 2017-07-11 | $34,852,000 |
| 9681032 | Imager module with molded packaging | Tak Shing Pang | 2017-06-13 | $53,479,000 |