Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847268 | Semiconductor package and manufacturing method thereof | Kian-Hock Lim | 2017-12-19 |
| 9754899 | Semiconductor structure and method of fabricating the same | Hwee-Seng Jimmy Chew | 2017-09-05 |
| 9723717 | Substrate structure, semiconductor package device, and manufacturing method of semiconductor package | Hwee-Seng Jimmy Chew | 2017-08-01 |
| 9653323 | Manufacturing method of substrate structure having embedded interconnection layers | Hwee-Seng Jimmy Chew | 2017-05-16 |
| 9583449 | Semiconductor package | Hwee-Seng Jimmy Chew, Kian-Hock Lim, Oviso Dominador Jr Fortaleza | 2017-02-28 |