HC

Hwee-Seng Jimmy Chew

AP Advanpack Solutions Pte: 4 patents #2 of 4Top 50%
📍 Singapore, SG: #58 of 1,548 inventorsTop 4%
Overall (2017): #46,306 of 506,227Top 10%
4
Patents 2017

Issued Patents 2017

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
9754899 Semiconductor structure and method of fabricating the same Shoa-Siong Raymond Lim 2017-09-05
9723717 Substrate structure, semiconductor package device, and manufacturing method of semiconductor package Shoa-Siong Raymond Lim 2017-08-01
9653323 Manufacturing method of substrate structure having embedded interconnection layers Shoa-Siong Raymond Lim 2017-05-16
9583449 Semiconductor package Kian-Hock Lim, Oviso Dominador Jr Fortaleza, Shoa-Siong Raymond Lim 2017-02-28