Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721799 | Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof | Chih-Cheng Lee | 2017-08-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721799 | Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof | Chih-Cheng Lee | 2017-08-01 |