Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812387 | Semiconductor substrate, semiconductor module and method for manufacturing the same | Chih-Cheng Lee | 2017-11-07 |
| 9754906 | Double plated conductive pillar package substrate | Chih-Cheng Lee | 2017-09-05 |
| 9549468 | Semiconductor substrate, semiconductor module and method for manufacturing the same | Chih-Cheng Lee | 2017-01-17 |