Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9466568 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Chanh Tran, Ying Ji | 2016-10-11 | $2,899,000 |
| 9244112 | Method for detecting an electrical defect of contact/via plugs | Hsiang-Chou Liao, Tuung Luoh, Ta-Hone Yang, Kuang-Chao Chen | 2016-01-26 | |
| 9236497 | Methods for fabricating semiconductor device | Jeng-Hwa Liao, Jung-Yu Shieh | 2016-01-12 |