Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449900 | Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow | Suebphong Yenrudee | 2016-09-20 |
| 9449905 | Plated terminals with routing interconnections semiconductor device | — | 2016-09-20 |
| 9397031 | Post-mold for semiconductor package having exposed traces | — | 2016-07-19 |
| 9355940 | Auxiliary leadframe member for stabilizing the bond wire process | — | 2016-05-31 |
| 9349679 | Singulation method for semiconductor package with plating on side of connectors | Somchai Nondhasitthichai | 2016-05-24 |